A. Nikmah, R.A. Firdaus, H. Purnomo, Y.D. Saputra, N. Winarno
This research utilizes the Finite Difference Time Domain (FDTD) method, originally designed for electromagnetic wave propagation, to analyze heat conduction in aluminum, tin, and copper plates. The novelty of this adaptation lies in its ability to simulate temperature distribution effectively on conductive plates by solving differential diffusion equations. Specifically, Von Neumann boundary conditions are applied to model the heat transfer, ensuring the stability of the simulation by controlling temperature gradients at the edges of the plates. The simulation results, presented through two graphs - one showing temperature changes over time and the other illustrating spatial temperature distribution - reveal aluminum's faster temperature rise due to its higher thermal conductivity, which is about 2.5 times greater than that of tin and copper. Aluminum's rate of temperature change reached approximately 10°C per second in the initial phase, compared to 4°C and 6°C for tin and copper, respectively. These findings provide a deeper understanding of heat transfer dynamics in various materials, essential for optimizing thermal management in applications such as electronics and industrial processes. By advancing computational thermal analysis through the FDTD method, this study contributes to improved design strategies for efficient heat dissipation and supports future developments in thermal conductivity research. © 2025 Author(s).
Department of Physics, Faculty of Mathematics Natural Sciences, State University of Surabaya, Surabaya, 60231, Indonesia; Department of Mathematics, Faculty of Mathematics Natural Sciences, State University of Surabaya, Surabaya, 60231, Indonesia; Physics Department, Faculty of Mathematics and Natural Sciences, Riau University, Indonesia; Department of Science Education, Faculty of Mathematics and Science Education, UPI, Bandung, Indonesia
